Mo50Cu50 tepelné jímky, chladiče
Mo50Cu50 varme dræn, varme dræn
Mo50Cu50 heatsinks, heat sinks
Mo50Cu50 heat sinks, heat sinks
Mo50Cu50, dissipateurs thermiques, dissipateurs thermiques
Mo50Cu50 Kühlkörper, Kühlkörper
Dissipatori di calore Mo50Cu50, dissipatori di calore
Mo50Cu50 varme vasker, kjøleelementer
Dissipadores de calor Mo50Cu50, dissipadores de calor
Chiuvete de căldură Mo50Cu50, chiuvete de căldură
Mo50Cu50 теплоотвода, теплоотводы
Receptores de calor Mo50Cu50, disipadores térmicos
Mo50Cu50 värme sänkor, värme avledning
Mo50Cu50 ısı lavabolar, ısı lavabolar
Molybdenum copper heat sinks

Mo50Cu50 heat sinks

Mo50Cu50 heat sinks Mo50Cu50 heat sinks Mo50Cu50 heat sinks
  • Composition: Mo 50%, Cu 50%
  • Density: 9.4g/cm3
  • Coefficient of Thermal Expansion (10-6/K): 9.8
  • Thermal Conductivity (W/mK): 245
  • Specific Heat Capacity (J/kgK): 320
  • Length: 5mm-300mm
  • Width: 5mm-300mm
  • Thickness: 0.1mm-5.0mm

Molybdenum Copper high performance composites are fabricated from carefully controlled porous Molybdenum that is vacuum infiltrated with molten copper. This results in a MoCu composite that has high conductivity and a matched low thermal expansion for heat sinks.

Molybdenum copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of molybdenum, molybdenum copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make molybdenum copper alloy an excellent choice even for extremely dense circuits.

It is a composite of molybdenum and copper. By controlling the content of molybdenum, we can design its coefficient of thermal expansion (CTE), matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Kovar, etc.

Advantages: High thermal conductivity, Excellent hermetic, Excellent size control, surface finish and flatness, Semi-finished or finished (Ni/Au plated) products available

The data of copper molybdenum sheet

Ingredients Name

CAS Number

% Weight

Molybdenum 7439-98-7 50-85
Copper 7440-50-8 15-50



Mo 85%
Cu 15%

Mo 70%
Cu 30%

Mo 50%
Cu 50%

10.0 9.6 9.5
Coefficient of Thermal Expansion
6.3 7.5 9.8
Thermal Conductivity
160 190 245
Specific Heat Capacity
275 300 320
Young’s Modulus
275 220 170
Specific Electrical Resistance
0.044 0.035 0.027
Vickers Hardness
235 175 145

Related Links

Copper Tungsten Heat Sinks
Copper Molybdenum Heat Sinks
Property Data Sheet of Molybdenum Copper Heat Sinks (PDF)
Property Data Sheet of Copper Tungsten Heat Sinks (PDF)

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