Tungsten copper heat sink is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Metals (Kovar), etc. The products are widely application in the fields such as radio frequency, microwave, high power diode packaging and optical communication system.

Advantages: High thermal conductivity, Excellent hermetic, Excellent size control, surface finish and flatness, Semi-finished or finished (Ni/Au plated) products available properties of WCu and MoCu heat materials.

Marketable products
Mo85Cu15 heat sinks
Composition: Mo 85%, Cu 15%
Density: 10.0g/cm3
Coefficient of Thermal Expansion (10-6/K): 6.3
Thermal Conductivity (W/mK): 160
Specific Heat Capacity (J/kgK): 275
Length: 5mm-300mm, Width: 5mm-300mm, Thickness: 0.1mm-5.0mm
Cu-Mo-Cu heat sinks
Cu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
Cu-Mo70Cu-Cu heat sinks
Cu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu:Mo-Cu:Cu is 1:4:1. It has different CTE in X and Y direction, higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and more cheap. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.
W70Cu30 heat sinks
Composition: W 70%, Cu 30%
Density: 14.2g/cm3
Coefficient of Thermal Expansion (10-6/K): 9.2
Thermal Conductivity (W/mK): 256
Specific Heat Capacity (J/kgK): 232
Length: 5mm-100mm, Width: 5mm-100mm, Thickness: 0.2mm-5.0mm
W85Cu15 heat sinks
Composition: W 85%, Cu 15%
Density: 16.4g/cm3
Coefficient of Thermal Expansion (10-6/K): 5.8
Thermal Conductivity (W/mK): 196
Specific Heat Capacity (J/kgK): 175
Length: 5mm-100mm, Width: 5mm-100mm, Thickness: 0.2mm-5.0mm
Heat sinks material
It owns not only the low expansion of tungsten and high heat conductivity of copper. Its expansion index and heat conductivity can also be changed through changing the content of the materials, which provides convenience to the using of the material. We can supply various specifications and the Copper tungsten sheet with different tungsten proportions.
Copper tungsten material
Copper tungsten alloy product is a sintered copper-tungsten material manufactured by powder metallurgy. It forms dense composite offering hardness, wear resistance and a high softening temperature of tungsten combined with the good electrical conductivity of copper.
Silver tungsten electrode
Composition: W 30%-80%, Ag 20%-70%
Density: 11.75-16.10 g/cm3
Under the relative intensity conditions, silver-tungsten performs exceptionally good electrical conductivity and stability in comparison with the super-hard metal such as tungsten-steel etc. it can also keep fine acute angle, it has the better performance than copper-tungsten in aspects of loss.
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