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Molybdenum copper heat sinks
Molybdenum copper heat sinks
Molybdenum copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of molybdenum, molybdenum copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make molybdenum copper alloy an excellent choice even for extremely dense circuits.
Composition: Mo 50%, Cu 50%
Density: 9.4g/cm3
Coefficient of Thermal Expansion (10-6/K): 9.8
Thermal Conductivity (W/mK): 245
Specific Heat Capacity (J/kgK): 320
Length: 5mm-300mm, Width: 5mm-300mm, Thickness: 0.1mm-5.0mm
Density: 9.4g/cm3
Coefficient of Thermal Expansion (10-6/K): 9.8
Thermal Conductivity (W/mK): 245
Specific Heat Capacity (J/kgK): 320
Length: 5mm-300mm, Width: 5mm-300mm, Thickness: 0.1mm-5.0mm
Composition: Mo 60%, Cu 40%
Density: 9.5g/cm3
Coefficient of Thermal Expansion (10-6/K): 8.7
Thermal Conductivity (W/mK): 215
Specific Heat Capacity (J/kgK): 310
Length: 5mm-300mm, Width: 5mm-300mm, Thickness: 0.1mm-5.0mm
Density: 9.5g/cm3
Coefficient of Thermal Expansion (10-6/K): 8.7
Thermal Conductivity (W/mK): 215
Specific Heat Capacity (J/kgK): 310
Length: 5mm-300mm, Width: 5mm-300mm, Thickness: 0.1mm-5.0mm
Composition: Mo 70%, Cu 30%
Density: 9.6g/cm3
Coefficient of Thermal Expansion (10-6/K): 7.5
Thermal Conductivity (W/mK): 190
Specific Heat Capacity (J/kgK): 300
Length: 5mm-300mm, Width: 5mm-300mm, Thickness: 0.1mm-5.0mm
Density: 9.6g/cm3
Coefficient of Thermal Expansion (10-6/K): 7.5
Thermal Conductivity (W/mK): 190
Specific Heat Capacity (J/kgK): 300
Length: 5mm-300mm, Width: 5mm-300mm, Thickness: 0.1mm-5.0mm
Composition: Mo 85%, Cu 15%
Density: 10.0g/cm3
Coefficient of Thermal Expansion (10-6/K): 6.3
Thermal Conductivity (W/mK): 160
Specific Heat Capacity (J/kgK): 275
Length: 5mm-300mm, Width: 5mm-300mm, Thickness: 0.1mm-5.0mm
Density: 10.0g/cm3
Coefficient of Thermal Expansion (10-6/K): 6.3
Thermal Conductivity (W/mK): 160
Specific Heat Capacity (J/kgK): 275
Length: 5mm-300mm, Width: 5mm-300mm, Thickness: 0.1mm-5.0mm
Cu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
Cu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu:Mo-Cu:Cu is 1:4:1. It has different CTE in X and Y direction, higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and more cheap. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.